Vancouver, British Columbia–(Newsfile Corp. – May 29, 2023) – Yellow Stem Tech Inc. (CSE: YY) (the “Company”) provides an update on corporate events.

Name Change

As disclosed in the Company’s news release of May 15, 2023, the Company’s name change from Yellow Stem Tech Inc. to Sweet Poison Spirits Inc. will be effective on June 1, 2023. The Company’s trading symbol will change to “SPS”, and the new CUSIP number for the Company’s common shares will be 87043J104.

Business Update

The name change is a result of the Company rebranding itself and all its affiliated businesses. Principally the Company will be operating under its Product Distribution Agreement (the “Distribution Agreement”) with Sweet Poison Spirits S de RL de CV, a Mexican company headquartered in Guadalajara, Mexico, and Sweet Poison Spirits LLC, a California limited liability corporation headquartered in San Diego, California (collectively, “Sweet Poison”) to distribute Sweet Poison’s premium Tequila and Mezcal products under the “Sweet Poison” brand names. For details of the Distribution Agreement and the related industry, please see the Company’s Listing Statement dated March 27, 2023 as filed on SEDAR and the CSE website. Please also refer to the Company’s news release of May 15, 2023, which sets out terms of amendments to the Distribution Agreement. The Listing Statement is being reviewed by the CSE, and so is subject to change. Any material changes will be outlined in a subsequent news release and reflected in a revised Listing Statement.

While distributing Sweet Poison spirits under the Distribution Agreement will be the Company’s primary focus in the next 12 months, the Company continues to monitor the pricing of cryptocurrencies, with a view to restarting its mining operations should it again become profitable. As noted in prior disclosure, the Company ceased mining cryptocurrency shortly after acquiring its mining rigs due to a material decline in cryptocurrency prices. Similarly, while the Company is not presently carrying any activities in the hemp growing and product manufacturing business, the Company may re-initiate such business under the “Sweet Poison” brand, should that industry again look profitable.

The Company intends to investigate new and alternative businesses that are complementary to management’s skills and expertise, all of which will be operated under the “Sweet Poison” brand.

Private Placement

As previously announced (see news release of May 15, 2023), the Company has arranged a non-brokered private placement of up to $1 million through the issuance of up to 10 million units (the “Units”) at a price of $0.10 per Unit. Funds will be used primarily to acquire inventory from Sweet Poison, to arrange new distribution agents, and for marketing costs associated with distributing the Sweet Poison tequila and mezcal products.

ON BEHALF OF THE BOARD

Signed “Robert Eadie”
Robert Eadie, President, Chief Executive Officer and Director

FOR FURTHER INFORMATION PLEASE CONTACT:
Telephone: 1-604-602-4935 ? Facsimile: 1-604-602-4936
Contact: Robert Eadie

Neither the Canadian Securities Exchange nor its Regulation Services Provider (as that term is defined in the policies of the Canadian Securities Exchange) accepts responsibility for the adequacy or accuracy of this release.

Certain statements and information herein, including all statements that are not historical facts, contain forward-looking statements and forward-looking information within the meaning of applicable securities laws. Such forward-looking statements or information include but are not limited to statements or information with respect to closing of agreements and future operations.

Forward-looking statements and information by their nature are based on assumptions and involve known and unknown risks, uncertainties and other factors which may cause the Company’s actual results, performance or achievements to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements or information. There is no assurance the Company will be able to execute its distribution plans profitably, or at all. The Company does not undertake to update any forward-looking information, except in accordance with applicable securities laws.

To view the source version of this press release, please visit https://www.newsfilecorp.com/release/167774

Integrating new NVIDIA GPU chiplet into the MediaTek Dimensity Auto platform provides the most advanced AI, connectivity and computing capabilities for next-generation smart cabins

TAIPEI, May 29, 2023 /PRNewswire/ — MediaTek today announced a partnership with NVIDIA to deliver a complete range of in-vehicle AI cabin solutions for the next generation of software-defined vehicles. The collaboration combines the strength of each company’s automotive portfolios to deliver the most compelling solutions for state-of-the-art connected cars.

“NVIDIA is a world-renowned pioneer and industry leader in AI and computing. With this partnership, our collaborative vision is to provide a global one-stop shop for the automotive industry, designing the next generation of intelligent, always-connected vehicles,” said Rick Tsai, Vice Chairman and CEO of MediaTek. “Through this special collaboration with NVIDIA, we will together be able to offer a truly unique platform for the compute intensive, software-defined vehicle of the future.”

“AI and accelerated computing are fueling the transformation of the entire auto industry,” said Jensen Huang, founder and CEO of NVIDIA. “The combination of MediaTek’s industry-leading SoC and NVIDIA’s GPU and AI software technologies will enable new user experiences, enhanced safety and new connected services for all vehicle segments, from luxury to mainstream.”

Through this collaboration, MediaTek will develop automotive SoCs integrating a new NVIDIA GPU chiplet with NVIDIA AI and graphics IP. Chiplets are connected by an ultra-fast and coherent chiplet interconnect technology.

MediaTek’s smart cabin solutions will run NVIDIA DRIVE OS, DRIVE IX, CUDA and TensorRT software technologies — delivering a full range of AI cabin and cockpit functions with cutting-edge graphics, AI, safety and security features.

MediaTek will work with NVIDIA to deliver automotive solutions that surpass the industry’s growing needs and demands while posing a significant market opportunity for the companies. According to Gartner^®, the total addressable market for infotainment and instrument cluster SoCs used within vehicles will reach $12 billion in 2023.¹

By tapping NVIDIA’s core expertise in AI, cloud, graphics technology and software, and pairing with NVIDIA ADAS solutions, MediaTek can bolster the capabilities of its comprehensive Dimensity Auto platform, which leverages the company’s expertise in mobile computing, high-speed connectivity, entertainment and extensive Android ecosystem, to deliver an all-around smarter in-vehicle experience.

About MediaTek Inc.
MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

For further information, contact:

MediaTek Press Office:
[email protected]
Kevin Keating
+1- 206-321-7295
10188 Telesis Ct #500, San Diego, CA 92121, USA

¹ Gartner, Forecast Analysis: Automotive Semiconductors, Worldwide, 2021-2031, January 18, 2023; Table 1 – Automotive Semiconductor Forecast by Application (Billions of U.S. Dollars)

Calculation performed by NVIDIA based on Gartner research. GARTNER is a registered trademark and service mark of Gartner, Inc. and/or its affiliates in the U.S. and internationally and is used herein with permission. All rights reserved.

SOURCE MediaTek Inc.

From the Data Center to the Edge, Supermicro Designs and Manufactures Total Rack Scale Solutions to Achieve Superior Performance, Flexibility, and Energy Efficiency with Rapid Deployment 

SAN JOSE, Calif. and TAIPEI, Taiwan, May 29, 2023 /PRNewswire/ — Super Micro Computer, Inc. (Nasdaq: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, continues to innovate with a broad range of servers to meet IT requirements for modern workloads. Supermicro’s Building Block Server® methodology enables a first-to-market delivery with the latest technology from Intel, AMD, and NVIDIA. Purpose built servers deliver exceptional performance for a wide range of AI, Cloud, and 5G workloads, from the data center to the edge.

“As we expand our production capacity to meet the rapidly growing demand of high-performance large-scale AI infrastructure and cloud data centers, Supermicro delivers the industry’s most innovative and advanced systems integrated as a turn-key total rack solution,” said Charles Liang, president and CEO of Supermicro. “From the most powerful AI systems available, with up to eight NVIDIA H100 HGX GPUs to compact edge servers that must perform in challenging environmental conditions we provide the broadest portfolio of solutions for today’s most demanding workloads, including new liquid cooling solutions that reduce data center power consumption and increase performance.”

At the COMPUTEX 2023 event, Supermicro will be showcasing a wide range of servers and storage solutions and demonstrate the fully integrated rack with the newest liquid cooling technologies that enable unprecedented energy efficiency and fast deployment.

The highlights of the Supermicro lineup at COMPUTEX 2023 include the following:

• Rack Scale Liquid Cooling – Supermicro’s full rack liquid cooling solution enables organizations to run the highest performing GPU servers and maintain the optimal operating conditions. Supermicro supplies, integrates, and tests complete rack level liquid cooling solutions, including CDUs with redundant power and pumps, Cooling Distribution Manifolds (CDM), leakproof connectors, and optimized hoses. In addition, a Supermicro designed highly efficient cold plate enhances heat removal from both CPUs and GPUs.
   
• GPU-Optimized Systems – Servers with 8 or 4 NVIDIA HGX H100 Tensor Core GPUs and dual 4^th Gen Intel Xeon Scalable processors or dual 4^th Gen AMD EPYC processors. The X13 and H13 GPU systems are open, modular, standards-based servers that provide superior performance and serviceability with a hot-swappable, toolless design. GPU options include the latest PCIe, OAM, and NVIDIA SXM technology. These GPU servers are ideal for workloads with the most demanding AI training performance, HPC, and Big Data Analytics. The new Intel GPU Max series and a new server using the NVIDIA Grace Superchip are also available.
   
• SuperBlade® – Supermicro’s high-performance, density-optimized, and energy-efficient X13 SuperBlade, built with 4^th Gen Intel Xeon Scalable processors, can significantly reduce initial capital and operational expenses for many organizations. SuperBlade utilizes shared, redundant components, including cooling, networking, power, and chassis management, to deliver the compute performance of an entire server rack in a much smaller physical footprint. These systems support GPU-enabled blades and are optimized for AI, Data Analytics, HPC, Cloud, and Enterprise workloads. Compared to industry-standard servers, a cable reduction of up to 95% reduces costs and can lower power usage.
   
• Hyper – With dual 4^th Gen Intel Xeon Scalable processors or dual 4^th Gen AMD EPYC processors – The X13 and H13 Hyper series brings next-generation performance to Supermicro’s range of rackmount servers, built to take on the most demanding workloads along with the storage & I/O flexibility that provides a custom fit for a wide range of application needs.
   
• BigTwin® (2U4N) – The X13 BigTwin with dual 4^th Gen Intel Xeon Scalable processors per node to provide superior density, performance, and serviceability with hot-swappable components in a toolless design. These systems are ideal for cloud, storage, and media workloads.
   
• CloudDC – With 4^th Gen Intel Xeon Scalable processors or 4^th Gen AMD EPYC processors – Ultimate flexibility on I/O and storage with 2 or 6 PCIe 5.0 slots and dual AIOM slots (PCIe 5.0; OCP 3.0 compliant) for maximum data throughput. Supermicro X13 and H13 CloudDC systems are designed for convenient serviceability with toolless brackets, hot-swap drive trays, and redundant power supplies that ensure rapid deployment and more efficient maintenance in data centers.
   
• GrandTwin™ – Using with 4^th Gen Intel Xeon Scalable processor or 4^th Gen AMD EPYC processor – The X13 and H13 GrandTwin is purpose-built for single-processor performance. The design maximizes computing performance, memory, and efficiency to deliver maximum density. GrandTwin’s flexible modular design can be easily adapted for a wide range of applications, with the ability to add or remove components as required, reducing cost. In addition, the Supermicro GrandTwin features front (cold aisle) hot-swappable nodes, which can be configured with either front or rear I/O for easier serviceability. As a result, the X13 and H13 GrandTwin are ideal for workloads such as CDN, Multi-Access Edge Computing, Cloud Gaming, and High-Availability Cache Clusters.
   
• SuperEdge – Using the 4^th Gen Intel Xeon Scalable processor Supermicro’s X13 SuperEdge is designed to handle increasing compute and I/O density requirements of modern edge applications. With three customizable single-processor nodes, SuperEdge delivers high-class performance in a 2U, short-depth form factor. Each node is hot-swappable and offers front access I/O, making the system ideal for remote IoT, Edge, or Telco deployments. Additionally, with flexible Ethernet or Fiber connectivity options to the BMC, Super Edge makes it easy for customers to choose remote management connections per their deployment environments.
   
• Petascale Storage – The All-Flash NVMe systems powered by a 4^th Gen Intel Xeon Scalable processor or a 4^th Gen AMD EPYC processor offer industry-leading storage density and performance with EDSFF drives, allowing unprecedented capacity and performance in a single 1U chassis. The first in a coming lineup of X13 and H13 storage systems, these latest petascale servers support 9.5mm and 15mm E1.S or 7.5mm E3.S EDSFF (EYPC only) media designed with PCIe 5.0 interface. They are now shipping from all the industry-leading flash vendors.
   
• Liquid Cooled-AI Development Platform – The deskside liquid-cooled AI development platform addresses the thermal design power needs of the four NVIDIA® A100 Tensor Core GPUs and the two 4th Gen Intel Xeon Scalable CPUs to enable full performance while improving the overall system’s efficiency and enabling quiet (approximately 30dB) operation in an office environment. In addition, this system is designed to accommodate high-performing CPUs and GPUs, making it ideal for AI/DL/ML and HPC applications.

To learn more about Supermicro and talk to product experts at Computex Taipei 2023, visit
www.supermicro.com/computex.

To learn more about Supermicro’s wide range of products, visit www.supermicro.com.

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are transforming into a Total IT Solutions provider with server, AI, storage, IoT, and switch systems, software, and services while delivering advanced high-volume motherboard, power, and chassis products. The products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

SOURCE Super Micro Computer, Inc.

Supermicro Founder and CEO Charles Liang Will be Joined by Jensen Huang, NVIDIA CEO, and other Industry Luminaries to Outline Developments to Accelerate Cloud, AI, Edge, and Storage Workloads, Investments to Drive Rack Scale Manufacturing, and Innovations to Reduce the Environmental Impact of Today’s Datacenters with Green Computing Technologies

SAN JOSE, Calif. and TAIPEI, Taiwan, May 29, 2023 /PRNewswire/ — Super Micro Computer, Inc. (Nasdaq: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, continues to offer IT solutions for decreasing the environmental impact of today’s modern data center. Supermicro is advancing technology in critical areas such as product design, green computing, manufacturing, and rack scale integration which enables organizations to become productive and reduce energy consumption quickly.

“Our Green Computing focus enables Supermicro to design and manufacture state-of-the-art servers and storage systems with the latest CPU and GPU technologies from NVIDIA, Intel, and AMD that reduce power consumption,” said Charles Liang, president and CEO of Supermicro. “Our innovative rack scale liquid cooling option enables organizations to reduce data center power usage expenses by up to 40%. Our popular GPU Servers with the NVIDIA HGX H100 8-GPU server continue to be in demand for AI workloads. We are expanding our solution offerings with innovative servers that use the NVIDIA Grace CPU Superchip and are working closely with NVIDIA to bring energy-efficient servers to market for AI and other industries. Worldwide our manufacturing capacity is 4,000 racks today and more than 5,000 later this year.”

Supermicro has the most comprehensive portfolio to support AI workloads and other verticals. These innovative systems include single and dual-socket rack mount systems based on 4th Gen Intel Xeon Scalable processors and 4th Gen AMD EPYC processors in 1U, 2U, 4U, 5U, and 8U form factor supporting 1-10 GPUs as well the density-optimized SuperBlade® systems supporting 20 NVIDIA H100 GPUs in an 8U enclosure, and SuperEdge systems designed for IoT and edge environments. The newly announced E3.S Petascale storage systems offer significant performance, capacity, throughput, and endurance when training on very large AI datasets while keeping excellent power efficiencies.  

A new product family built on the NVIDIA Grace CPU Superchip will be available soon. These new servers will each contain 144 cores with dual CPUs joined by a 900GB/sec connection, allowing for highly responsive AI applications and those requiring extremely low latency responses. With the CPU running at 500W TDP, this system will reduce energy consumption for cloud-native workloads and the next generation of AI applications.

For more information, please visit: https://www.supermicro.com/en/products/system/GPU/2U/ARS-221GL-NR

With AI applications proliferating, the demand for high end AI designed servers is increasing, which brings new challenges for system providers to incorporate the latest CPUs and GPUs. The most advanced Supermicro GPU server incorporates dual CPUs and up to eight NVIDIA HGX H100 GPUs, which are available with a liquid cooled option, reducing OPEX.

“NVIDIA is closely working with Supermicro to quickly bring innovations to new server designs to meet the needs of the most demanding customers,” said Ian Buck, vice president of hyperscale and HPC at NVIDIA. “With Supermicro’s servers powered by Grace CPU Superchips shipping shortly and H100 GPUs gaining traction around the world, we’re working together to bring AI to a wide range of markets and applications.”

To reduce the TCO for customers, Supermicro is endorsing the new NVIDIA MGX reference architecture that will result in over a hundred server configurations for a range of AI, HPC, and Omniverse applications. This modular reference architecture includes CPUs, GPUs, and DPUs and is designed for multiple generations of processors.

Supermicro will also incorporate the latest NVIDIA networking technology, the NVIDIA Spectrum™-X networking platform in a broad range of solutions. The platform is the first designed specifically to improve the performance and efficiency of Ethernet-based AI clouds. Spectrum-X is built on network innovations powered by the tight coupling of the NVIDIA Spectrum-4 Ethernet switch plus NVIDIA BlueField^®-3 data processing unit (DPU). This breakthrough technology achieves 1.7X better overall AI performance and energy efficiency, along with consistent, predictable performance in multi-tenant environments.

Green computing is critical for today’s data centers, which consume 1 – 1.5% of worldwide electricity demand. Supermicro’s complete rack scale liquid cooling solution significantly reduces the need for traditional cooling methods. With redundant and hot-swappable power supplies and pumps, entire racks of high-performing AI and HPC optimized servers can be cooled efficiently even during a power supply or pump failure. This solution also uses custom-designed cold plates for both CPUs and GPUs, which are more efficient at removing heat than traditional designs. Up to $10B in energy costs can be saved if data centers lower their PUE closer to 1.0 with Supermicro technology and do not have to build 30 fossil fuel power plants.

To learn more about Supermicro Liquid Cooling Solutions, please visit:  www.supermicro.com/liquidcooling

The Supermicro Liquid Cooling Solution includes:

• CDU – the Cooling Distribution Unit, which circulates the liquid throughout the entire rack of servers.
• CDM – the Cooling Distribution Manifold delivers the cool liquid to each server and the return path.
• Cold Plates – attach directly to the CPUs or GPUs and are custom designed.
• Hoses/Connectors – for connecting the liquid from the server to the CDM with leakproof connectors.

Supermicro has qualified a number of servers from various product families with this state-of-the-art cooling solution. The server list includes the following:

• BigTwin®: 2U2N, 2U4N
• SuperBlade
• Hyper: 1U, 2U
• GPU Servers (PCIe and SXM)
• GrandTwin^TM 4U8N, 4U4N

Rack scale integration is another core competency that data center operators are demanding. Faster time to productivity requires entire racks to be delivered to data centers, ready to go. Supermicro has the ability to deliver L11 and L12 clusters, thoroughly tested, including customer applications, and configured for large scale liquid cooling when required.

To learn more about Supermicro and talk to product experts at Computex Taipei 2023, visit www.supermicro.com/computex

View the Supermicro CEO Keynote at Computex Taipei 2023 with Charles Liang and special guest and NVIDIA founder and CEO Jensen Huang.

To learn more about Supermicro’s wide range of products, visit   www.supermicro.com 

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are transforming into a Total IT Solutions provider with server, AI, storage, IoT, and switch systems, software, and services while delivering advanced high-volume motherboard, power, and chassis products. The products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

SOURCE Super Micro Computer, Inc.